NGK offers “Bonded wafer” combined with different materials. By combining the features of different materials, bonded wafer can improve the performance of electronic components such as high-frequency filters (SAW filters) for smartphones.
Bonded wafer by NGK’s proprietary technologies* can improve various characteristics of **. *Direct bonding of 2 types materials without adhesive and film-thinning of functional layer by polishing. **High-Insulation, High-Thermal Conductivity, Low-Thermal Expansion, High-Strength etc. We have started commercialization for SAW Filter Application in 2014. Our wafer has been adopted for High performance filter which is essential for 4G LTE. It is possible to achieve various combinations of materials(functional layer and base substrate).